SMA6850MX/MZ Series
High Voltage 3-Phase Motor Drivers
Features and Benefits
▪
▪
▪
▪
▪
▪
▪
▪
▪
Description
Built-in pre-drive IC
MOSFET power element
CMOS compatible input (3.3 to 5 V)
High-side gate driver using bootstrap circuit or floating
power supply
Built-in protection circuit for controlling power supply
voltage drop
Built-in overtemperature detection circuit (TD)
Output of fault signal during operation of protection
circuits
Output current 1.5, 2, and 2.5 A
Small SIP (SMA 24-pin)
The SMA6850MX/MZ inverter power module (IPM) series
provides a robust, highly-integrated solution for optimally
controlling 3-phase motor power inverter systems and variable
speed control systems used in energy-conserving designs to
drive motors of residential and commercial appliances. These
ICs take 230 VAC input voltage, and up to 2.5 A (continuous)
output current. They can withstand voltages of up to 500 V
(MOSFET breakdown voltage).
The SMA6850MX/MZ power package includes an IC with all
of the necessary power elements (six MOSFETs) and pre-driver
ICs (two), needed to configure the main circuit of an inverter.
This enables the main circuit of the inverter to be configured
with fewer external components than traditional designs.
Packages: Power SIP
Applications include residential white goods (home
applications) and commercial appliance motor control:
• Air conditioner fan
• Small ventilation fan
• Dishwasher pump
Not to scale
Leadform
2451
Leadform
2452
Functional Block Diagram
VB 1
VB 2
VB3
VCC1
VBB 1
VBB 2
UVLO
HIN1
HIN2
HIN3
Input
Logic
UVLO
UVLO
UVLO
High Side
Level Shift Driver
COM1
U
V
W1
W2
VCC2
VREG
LIN1
LIN2
LIN3
7.5V
Reg.
UVLO
Input
Logic
Low Side
Driver
COM2
FO
Thermal
Detection
A
Figure 1. Driver block diagram
SMA6850MXMZ
SANKEN ELECTRIC CO., LTD.
http://www.sanken-ele.co.jp/en/
LS 3
LS 2
LS1
A
Implemented in low-side MIC;
propagation delay in detecting
MOSFET temperature increase
High Voltage 3-Phase Motor Drivers
SMA6850MX/MZ
Selection Guide
Output Current
Part Number
Packing
MOSFET Breakdown
Voltage, VDSS(min)
(V)
Continuous, IO(max)
(A)
Pulsed, IOP (max)
(A)
SMA6852MZ
18 pieces per tube
500
1.5
2.25
SMA6853MX
18 pieces per tube
500
2.5
3.75
SMA6854MZ
18 pieces per tube
600
1.5
2.25
Absolute Maximum Ratings, valid at TA = 25°C
Characteristic
Symbol
Remarks
Rating
SMA6852MZ
MOSFET Breakdown Voltage
VDSS
SMA6853MX
VCC = 15 V, ID = 100 μA, VIN = 0 V
Logic Supply Voltage
VCC
Between VCC and COM
Bootstrap Voltage
VBS
Between VB and HS (U,V, and W phases)
SMA6854MZ
Output Current, Continuous
IO
Output Current, Pulsed
IOP
VIN
Allowable Power Dissipation
PD
500
V
500
V
600
V
20
V
20
V
SMA6852MZ
1.5
A
SMA6853MX
2.5
A
SMA6854MZ
1.5
A
SMA6852MZ
2.25
A
3.75
A
2.25
A
SMA6853MX
PW ≤ 100 μs, duty cycle = 1%
SMA6854MZ
Input Voltage
Unit
TC = 25°C
–0.5 to 7
V
28
W
Thermal Resistance (Junction to Case)
RθJC
All elements operating
4.46
°C/W
Thermal Resistance (Junction to Ambient)
RθJA
All elements operating
31.25
°C/W
Case Operating Temperature
°C
TCOP
–20 to 100
Junction Temperature (MOSFET)
TJ
150
°C
Storage Temperature
Tstg
–40 to 150
°C
Recommended Operating Conditions
Characteristic
Symbol
Remarks
SMA6852MZ
Main Supply Voltage
VBB
SMA6853MX
Between VBB and LS
SMA6854MZ
Min.
Typ.
Max.
Units
–
280
400
V
–
–
400
V
–
300
450
V
13.5
–
16.5
V
Logic Supply Voltage
VCC
Minimum Input Pulse
TW(min)
0.5
–
–
μs
tdead
1.5
–
–
μs
Dead Time
Between VCC and COM
All performance characteristics given are typical values for circuit or
system baseline design only and are at the nominal operating voltage and
an ambient temperature, TA, of 25°C, unless otherwise stated.
SMA6850MXMZ
SANKEN ELECTRIC CO., LTD.
2
High Voltage 3-Phase Motor Drivers
SMA6850MX/MZ
Typical Application Diagram
1
2
3
SMA685xMx
9
10
VB1 VB2 VB3
4
HO 1
VCC1
HS1
HVIC
8
7
6
5
24
HO 2
HS2
12
M
HIN 1
HIN 2
HIN 3
HO 3
COM1
HS3
11
14
23
VCC 2
LO 1
17
MC U
20
19
18
LVIC
LIN1
LIN2
LO 2
13
LIN3
LO 3
16
22
21
VREG
15
FO
COM 2
15 V
NOTE:
▪ All of the input pins are connected to GND with internal pull-down resistors rated at 100 kΩ, however, an external pull-down
resistor may be required to secure stable condition of the inputs if high impedance conditions are applied to them.
▪ The external electrolytic capacitors should be placed as close to the IC as possible, in order to avoid malfunctions from
external noise interference. Put a ceramic capacitor in parallel with the electrolytic capacitor if further reduction of noise
susceptibility is necessary.
▪ This IPM does not have an overcurrent detection feature. It is recommended to implement the feature externally. When an
overcurrent condition occurs, the application MCU must stop driving the IPM within 2 μs.
▪ Snubber capacitors should be surge suppressor film capacitors with sufficient rating to suppress surge voltavges. To determine
the capacitance for an application, please verify the surge voltage in the actual application.
SMA6850MXMZ
SANKEN ELECTRIC CO., LTD.
3
High Voltage 3-Phase Motor Drivers
SMA6850MX/MZ
ELECTRICAL CHARACTERISTICS, valid at TA=25°C, unless otherwise noted
Characteristics
Symbol
Conditions
Logic Supply Voltage
VCC
Between VCC and COM
Logic Supply Current
ICC
SMA6853MX
SMA6852MZ
Input Voltage
Input Voltage Hysteresis
Input Current
V
–
4
6
mA
–
2.5
4.0
mA
–
3.8
–
mA
–
2.0
2.5
V
VIL
VCC = 15 V, output off
1.0
1.5
–
V
VCC = 15 V
–
0.5
–
V
IIH
High side, VCC = 15 V, VIN = 5 V
–
50
100
μA
IIL
Low side, VCC = 15 V, VIN = 0 V
–
–
2
μA
9.0
10.0
11.0
V
9.5
10.5
11.5
V
–
0.5
–
V
10.0
11.0
12.0
V
10.5
11.5
12.5
V
–
0.5
–
V
0
–
1.0
V
VIhys
VUVHhys
VUVLL
VUVLhys
Output Voltage for Regulator
Units
16.5
VCC = 15 V, output on
VUVLH
Overtemperature Detection Threshold
Temperature (activation and
deactivation)
Max
15
SMA6854MZ
VUVHH
FO Terminal Output Voltage
Typ
VIH
VUVHL
Undervoltage Lock Out
VCC = 15 V, IREG = 0 A
Min
13.5
VFOL
VFOH
High side, between VB and U, V, or W
High side, hysteresis
Low side, between VCC and COM
Low side, hysteresis
VCC = 15 V
TDH
TDL
VCC = 15 V, no heatsink
TDhys
VREG
IREG = 35 mA, TC = –20°C to 100°C
4.0
–
5.5
V
135
150
165
°C
105
120
135
°C
–
30
–
°C
6.75
7.5
8.25
V
Bootstrap Diode Leakage Current
ILBD
VR = 500 V
–
–
10
μA
Bootstrap Diode Forward Voltage
VFBD
IF = 0.15 A
–
1.1
1.3
V
Bootstrap Diode Series Resistor
RBD
MOSFET Breakdown Voltage
VDSS
SMA6852MZ
17.6
22
26.4
Ω
SMA6853MX
17.6
22
26.4
Ω
SMA6854MZ
48
60
72
Ω
SMA6852MZ
500
–
–
V
500
–
–
V
600
–
–
V
SMA6853MX
VCC = 15 V, ID = 100 μA, VIN = 0 V
SMA6854MZ
MOSFET Leakage Current
MOSFET On State Resistance
MOSFET Diode Forward Voltage
SMA6850MXMZ
IDSS
RDS(on)
VSD
VCC = 15 V, VDS = 500 V, VIN = 0 V
–
–
100
μA
SMA6852MZ VCC = 15 V, ID = 0.75 A, VIN = 5 V
–
3.6
4.0
Ω
SMA6853MX VCC = 15 V, ID = 1.25 A, VIN = 5 V
–
2.0
2.4
Ω
SMA6854MZ VCC = 15 V, ID = 1.25 A, VIN = 5 V
–
3.0
3.5
Ω
SMA6852MZ VCC = 15 V, ISD = 0.75 A, VIN = 0 V
–
1.1
1.5
V
SMA6853MX VCC = 15 V, ISD = 1.25 A, VIN = 0 V
–
1.1
1.5
V
SMA6854MZ VCC = 15 V, ISD = 1.25 A, VIN = 0 V
–
1.0
1.5
V
SANKEN ELECTRIC CO., LTD.
4
High Voltage 3-Phase Motor Drivers
SMA6850MX/MZ
SMA6852MZ SWITCHING CHARACTERISTICS, valid at TA=25°C, unless otherwise noted
Characteristics
Switching Time, High Side
Symbol
Min
Typ
Max
Units
tdH(on)
–
530
–
ns
trH
–
95
–
ns
–
130
–
ns
–
385
–
ns
trr
Conditions
VBB = 300 V, VCC = 15 V, ID = 1.5 A, 0 V ≤ VIN ≤ 5 V
tdH(off)
tfH
–
40
–
ns
tdL(on)
–
530
–
ns
trL
Switching Time, Low Side
–
95
–
ns
–
120
–
ns
tdL(off)
–
445
–
ns
tfL
–
30
–
ns
Min
Typ
Max
Units
tdH(on)
–
650
–
ns
trH
–
100
–
ns
–
150
–
ns
–
520
–
ns
trr
VBB = 300 V, VCC = 15 V, ID = 1.5 A, 0 V ≤ VIN ≤ 5 V
SMA6853MX SWITCHING CHARACTERISTICS, valid at TA=25°C, unless otherwise noted
Characteristics
Switching Time, High Side
Symbol
trr
Conditions
VBB = 300 V, VCC = 15 V, ID = 2.5 A, 0 V ≤ VIN ≤ 5 V
tdH(off)
tfH
–
50
–
ns
tdL(on)
–
700
–
ns
–
100
–
ns
–
150
–
ns
tdL(off)
–
580
–
ns
tfL
–
40
–
ns
Min
Typ
Max
Units
tdH(on)
–
530
–
ns
trH
–
55
–
ns
–
125
–
ns
–
510
–
ns
trL
Switching Time, Low Side
trr
VBB = 300 V, VCC = 15 V, ID = 2.5 A, 0 V ≤ VIN ≤ 5 V
SMA6854MZ SWITCHING CHARACTERISTICS, valid at TA=25°C, unless otherwise noted
Characteristics
Switching Time, High Side
Symbol
trr
Conditions
VBB = 150 V, VCC = 15 V, ID = 2 A, 0 V ≤ VIN ≤ 5 V
tdH(off)
tfH
–
50
–
ns
tdL(on)
–
530
–
ns
–
60
–
ns
–
125
–
ns
tdL(off)
–
540
–
ns
tfL
–
55
–
ns
trL
Switching Time, Low Side
SMA6850MXMZ
trr
VBB = 150 V, VCC = 15 V, ID = 2 A, 0 V ≤ VIN ≤ 5 V
SANKEN ELECTRIC CO., LTD.
5
High Voltage 3-Phase Motor Drivers
SMA6850MX/MZ
5V
HIN
2 kΩ
LIN
100 kΩ
COM
V DS
HINx and LINx Terminals Internal Equivalent Circuit
5V
ID
100 Ω
Switching Characteristics Definitions
200 kΩ
FO
COM
FO Terminal Internal Equivalent Circuit
Truth Table
Mode
Normal
Thermal Detection
(TD)1
UVLO ( VCC )2
UVLO ( VB )3
Hin
Lin
H-side MOSFET
L-side MOSFET
L
L
Off
Off
H
L
On
Off
L
H
Off
On
H
H
On
On
L
L
Off
Off
H
L
On
Off
L
H
Off
On
H
H
On
On
L
L
Off
Off
H
L
Off
Off
L
H
Off
Off
H
H
Off
Off
L
L
Off
Off
H
L
Off
Off
L
H
Off
On
H
H
Off
On
1The
Thermal Detection function drives the FO pin output to logic high. The external microcontroller should detect
this condition.
2Returning to the Normal mode of operation from a V
CC UVLO condition, a low-side MOSFET resumes switching on the first
logic high of a LINx input.
3Returning to the Normal mode of operation from a V UVLO condition, a high-side MOSFET resumes switching on the rising
B
edge of an HINx input.
Note: To prevent a shoot-through condition, the external microcontroller should not drive HINx = LINx = H at the same time.
SMA6850MXMZ
SANKEN ELECTRIC CO., LTD.
6
High Voltage 3-Phase Motor Drivers
SMA6850MX/MZ
High Side Driver Input/Output Timing Diagrams
HIN
VUVHH
VB-HS
VUVHL
UVLO
Release
VCC1
VUVLL
VUVLH
A
HO
A
After a high-side UVLO is released, HO output is activated at the rising edge of HIN.
High-side UVLO conditions are not reflected in the FO pin output.
Low Side Driver Input/Output Timing Diagrams
LIN
VCC
VUVHH
VUVHL
UVLO
Release
LO
B
FO
TDH
TDL
TJ
B
SMA6850MXMZ
After a low-side UVLO is released, LO output is activated at the logic high of an LINx input.
Low-side UVLO conditions drive the FO pin to logic high.
SANKEN ELECTRIC CO., LTD.
7
High Voltage 3-Phase Motor Drivers
SMA6850MX/MZ
Pin-out Diagrams
Leadform 2451
1
3
2
5
4
7
6
9
8
11
10
13
12
15
14
17
16
19
18
21
20
23
22
Leadform 2452
24
1
3
2
5
4
7
6
9
8
11
10
13
12
15
14
17
16
19
18
21
20
23
22
24
Chamfer Side
Chamfer on Opposite Side
Terminal List Table
SMA6850MXMZ
Number
1
Name
VB1
Function
High side bootstrap terminal (U phase)
2
VB2
High side bootstrap terminal (V phase)
3
VB3
High side bootstrap terminal (W phase)
4
VCC1
High side logic supply voltage
5
COM1
High side logic GND terminal
6
HIN3
High side input terminal (W phase)
7
HIN2
High side input terminal (V phase)
8
HIN1
High side input terminal (U phase)
9
VBB1
Main supply voltage 1 (connect to VBB2 externally)
10
VBB2
Main supply voltage 2 (connect to VBB1 externally)
11
W1
Output of W phase (connect to W2 externally)
12
V
13
LS2
Source terminal of V phase
Output of V phase
14
W2
Output of W phase (connect to W1 externally)
15
LS3
Source terminal of W phase
16
VREG
Internal regulator output terminal
17
LS1
Source terminal of U phase
18
LIN3
Low side input terminal (W phase)
19
LIN2
Low side input terminal (V phase)
20
LIN1
Low side input terminal (U phase)
21
COM2
22
FO
23
VCC2
24
U
Low side GND terminal
Overtemperature detection fault-signal output terminal
Low side logic supply voltage
Output of U phase
SANKEN ELECTRIC CO., LTD.
8
High Voltage 3-Phase Motor Drivers
SMA6850MX/MZ
Package Outline Drawing
Leadform 2451
Dual rows, 24 alternating pins; pins bent 90° for horizontal case mounting; pin #1 in outer row
Gate protrusion
31 ±0.2
4 ±0.2
2X Gate protrusion
1.2 ±0.1
BSC
10.2 ±0.2
Branding Area
2X Exposed
tie bar
3 ±0.5
BSC
2.2 ±0.7
BSC
R1
REF
4.4
REF
+0.15
– 0.05
C 0.7
View A
1
2
3
4
5
6
7
8
9
10
11
12
13
1.27 ±0.1 A
1.27 ±0.6 B
0.6 +0.15
– 0.05
14
15
16
17
18
19
20
21
22
23
2.2 ±0.7
BSC
24
0.7 MAX
A Measured at pin exit from case
B Measured at pin tips
C Maximum dambar protrusion
0.55 +0.2
– 0.1
Leadform: 2451
Terminal core material: Cu
Terminal plating: Ni and solder (Sn 97.5%, Ag 2.5%) plating
Case material: Epoxy resin
0.7 MAX
Deflection at pin bend
View A
Dimensions in millimeters
Branding codes (exact appearance at manufacturer discretion):
1st line, lot:
YMDD#
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
DD is the date
# is the letter X for the SMA6853MX series or
the reference number
2nd line, type: SMA6852MZ, SMA6853M, or SMA6854MZ
Leadframe plating Pb-free. Device composition
complies with the RoHS directive.
SMA6850MXMZ
SANKEN ELECTRIC CO., LTD.
9
High Voltage 3-Phase Motor Drivers
SMA6850MX/MZ
Package Outline Drawing
Leadform 2452
Dual rows, 24 alternating pins; vertical case mounting; pin #1 opposite chamfer side
Gate protrusion
31 ±0.2
4 ±0.2
2X Gate protrusion
1.2 ±0.1
BSC
10.2 ±0.2
2X Exposed
tie bar
Branding Area
5 ±0.5
9.5 +0.7
– 0.5
R1
REF
0.5 +0.15
– 0.05
4.5
REF
1.27 ±0.5 A
4.5 ±0.5
0.6 +0.15
– 0.05
View A
2
1
A
4
3
6
5
8
7
Measured at pin tips
10
9
12
11
14
13
16
15
18
17
20
19
22
21
24
23
0.7 MAX
Leadform: 2452
Terminal core material: Cu
Terminal plating: Ni
Recommended attachment: Solder dip (Sn-Ag-Cu)
0.7 MAX
Deflection at pin bend
View A
Dimensions in millimeters
Branding codes (exact appearance at manufacturer discretion):
1st line, lot:
YMDD#
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
DD is the date
# is the letter X for the SMA6853MX series or
the reference number
2nd line, type: SMA6852MZ, SMA6853M, or SMA6854MZ
Leadframe plating Pb-free. Device composition
complies with the RoHS directive.
SMA6850MXMZ
SANKEN ELECTRIC CO., LTD.
10
High Voltage 3-Phase Motor Drivers
SMA6850MX/MZ
Because reliability can be affected adversely by improper storage
environments and handling methods, please observe the following
cautions.
Cautions for Storage
•
Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience
extreme changes in temperature or humidity.
•
Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
•
Reinspect for rust on leads and solderability of products that have
been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other
standard test periods, protect the products from power surges
from the testing device, shorts between adjacent products, and
shorts to the heatsink.
Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting this product on a
heatsink, it shall be applied evenly and thinly. If more silicone
grease than required is applied, it may produce stress.
• Volatile-type silicone greases may permeate the product and
produce cracks after long periods of time, resulting in reduced
heat radiation effect, and possibly shortening the lifetime of the
product.
• Our recommended silicone greases for heat radiation purposes,
which will not cause any adverse effect on the product life, are
indicated below:
Type
Suppliers
G746
Shin-Etsu Chemical Co., Ltd.
YG6260
Momentive Performance Materials
SC102
Dow Corning Toray Silicone Co., Ltd.
SMA6850MXMZ
Soldering
•
When soldering the products, please be sure to minimize the
working time, within the following limits:
260±5°C 10 s
380±5°C 5 s
• Soldering iron should be at a distance of at least 1.5 mm from the
body of the products
Electrostatic Discharge
•
When handling the products, operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
resistance to ground to prevent shock hazard.
•
Workbenches where the products are handled should be
grounded and be provided with conductive table and floor mats.
•
When using measuring equipment such as a curve tracer, the
equipment should be grounded.
•
When soldering the products, the head of soldering irons or the
solder bath must be grounded in other to prevent leak voltages
generated by them from being applied to the products.
•
The products should always be stored and transported in our
shipping containers or conductive containers, or be wrapped in
aluminum foil.
SANKEN ELECTRIC CO., LTD.
11
SMA6850MX/MZ
High Voltage 3-Phase Motor Drivers
• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document
before use.
• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume
no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from
its use.
• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is
inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any
possible injury, death, fires or damages to the society due to device failure or malfunction.
• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances,
office equipment, telecommunication equipment, measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic
signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose
electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear
power control systems, life support systems, etc.) is strictly prohibited.
• In the case that you use our semiconductor devices or design your products by using our semiconductor devices, the reliability largely depends on the degree of
derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge
voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage,
electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor
devices. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC’s including power devices have large self-heating value, the degree of derating of junction temperature
(TJ) affects the reliability significantly.
• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or
treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility.
• Anti radioactive ray design is not considered for the products listed herein.
• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken’s distribution network.
• The contents in this document must not be transcribed or copied without Sanken’s written consent.
SMA6850MXMZ
SANKEN ELECTRIC CO., LTD.
12
工商网监
湘ICP备2023018690号
